IXON to demo at Techstars Sustainability Summit

Techstars, the worldwide network that helps entrepreneurs succeed, will be holding its inaugural Sustainability Summit on April 15. During the event, entrepreneurs, investors, corporate leaders and policy makers from around the world will gather virtually to learn the latest solutions and challenges in climate change and sustainability. And IXON has been selected as one of six Techstars portfolio companies to demo their technology at this prestigious event.

“We are honored to have been selected by Techstars to showcase our technology alongside Overstory.ai, Rheaply, Material Evolution, Craste and Nori,” says Felix Cheung, founder and CEO of IXON. “Climate change and sustainability are pressing issues that require concerted efforts from all sides. It is for this reason that we developed advanced sous-vide aseptic packaging, a technology for solving food insecurity, safety and sustainability problems.”

As of today, over 2,900 attendees have registered for the event. We urge all interested parties to join Techstars Sustainability Summit by registering via this link: https://hopin.com/events/the-techstars-sustainability-summit

全球最大企業家網絡Techstars將於4月15日舉行其首個可持續發展峰會，屆時來自世界各地的企業家、投資者、企業領導者和政策制定者將聚首一堂，並深入了解與氣候變化和可持續性有關的最新方案和挑戰。 IXON已被Techstars選為在此享有盛譽的活動上演示其技術的六家初創公司之一。

IXON創始人兼行政總裁Felix Cheung說：「我們很榮幸被Techstars選中，與Overstory.ai、Rheaply、Material Evolution、Craste和Nori等公司一起展示技術。氣候變化和可持續發展是迫切問題，需要各方的共同努力，亦出於這個原因，我們開發了先進低溫真空無菌包裝，該技術可解決糧食短缺、食品安全和可持續性問題。」

到目前為止，已有2900多名與會者註冊了該活動。我們敦促所有感興趣人士通過以下連結進行註冊：https://hopin.com/events/the-techstars-sustainability-summit